2027深圳传感器展 展馆布局 展示范围

一、各类传感器及相关产品：运动传感器、声学传感器、压力传感器、红外传感器、气体传感器、图像传感器、光学传感器、射频类传感器、生物传感器、温湿度传感器、磁传感器、其他；ASIC、控制、通信、软件、边缘计算、算法、通讯模组、云计算等；
All kinds of sensors and related products: Motion sensor, acoustic sensor, pressure sensor, infrared sensor, gas sensor, image sensor, optical sensor, RFIDs, biological sensor, temperature and humidity sensor, magnetic sensor, MEMS chip other:ASIC, Control, communi-cation, software, edge computing, algorithms, communication modules, cloud computing, etc;

二、传感器生产与制造：传感器材料、封装与测试、制造部件、制造设备与工艺平台、EDA、设计服务等；
Sensor Production & Manufacturing: materials, packaging & testing technologies, manufacturing, components, equipment, design, etc;

三、传感器应用：AIOT技术、传感器融合、物联网、智慧家居、生物医疗、汽车电子、智能制造、智能机器人、可穿戴设备、能源与环境、智能安防、智慧工厂等；
Applications: AIOT technology, sensor integration,IOT, smart home, biomedical, automotive electronics, intelligent manufacturing, intelligent robots, wearable devices, energy and environment, intelligent security, smart factories, etc;

四、工业控制：RISC/ARM计算平台、工业存储、工业无线通信模块、工业主板、工业显示器、工业平板电脑、数据采集与控制、网关/远程智能终端、远程I/O模块、自动化控制器、工业路由器、工业网关、工业以太网交换机等；
Industrial control: RISC/ARM computing platform, industrial storage, wireless communication module, industrial motherboard, industri-al display, industrial tablet computer, data acquisition and control, gateway/remote intelligent terminal, remote I/O module, automa-tion controller, industrial router, industrial gateway, industrial Ethernet switch, etc;

五、测试测量：测试测量服务、测试测量仪器、测试测量工具,检测系统、视觉检测设备、厚度检测设备、红外测试设备等、高端精密机械与设备，分析仪器、实验室仪器与设备、电子测试仪器与软件等；
Testing and measurement: testing and measurement services and instruments,tools; Inspection systems, visual inspection equipment, thickness detection equipment, infrared testing equipment, etc; High end precision machinery and equipment, analytical instruments,  electronic testing instruments and software, etc;

六、嵌入式系统：嵌入式操作系统与工具、嵌入式硬件工程技术、MCU与嵌入式处理器、RISC-V与开源硬件、嵌入式AI、工业计算机及配件、电源与储能、功率器件与第三代半导体、高性能连接器、嵌入式与物联网安全、机器视觉与智能系统、材料与服务等；
Embedded systems: embedded operating systems and tools, embedded hardware engineering technology, MCU and embedded pro-cessors, RISC-V and open-source hardware, embedded AI, industrial computers and accessories, power and energy storage, power devices and third-generation semiconductors,  connectors,  IoT security, machine vision and intelligent systems, materials and services, etc;